Thermal Management

JEDEC component thermal models, Statistical estimation of circuit heat dissipation, ECAD/MCAD data exchange, CFD simulation and boundary conditions, Multi-physics simulations, Temperature management, Determining heat and temperature distributions in PCBs, Metal core CCAs, Resistance network thermal modeling (e.g. Sauna,SINDA), Cold plate integration, TECs, Vapor chambers and heat pipes
Cookies are required to use this site. You must accept them to continue using the site. Learn more…