EEsj
Junior Member level 1
Hi I am trying to layout a bump pad. my layers (assume following DR) look like this
bump pad marking layer
top_metal layer
nwell (floating)
this does not give me any DRC errors which is what i expect.
When i incorporte this bump pad in my overall layout I recieve an nwell stamp error.
The DRM i am using calls for NWELL to be placed underneath wire bond pands so i assumed that this is the same for bump pads. please correct me if i am wrong
bump pad marking layer
top_metal layer
nwell (floating)
this does not give me any DRC errors which is what i expect.
When i incorporte this bump pad in my overall layout I recieve an nwell stamp error.
The DRM i am using calls for NWELL to be placed underneath wire bond pands so i assumed that this is the same for bump pads. please correct me if i am wrong