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IanP, your reference is talking about a different kind of burn-in.
Normally, when we talk about burn-in test, we refer to the process of taking the actual chips, and baking it in the oven, and running some stress patterns while it is baking.
After the baking process, the chips are tested if they still work.
There are two types of burn-in, one is for production quality, and the other is for accelerated life-test.
The production quality burn-in is usually relatively short (tens of hours). The theory behind this is that weak parts usually breaks down early in their life, we call these infant mortality. So baking it will accelerate the breakdown of weak parts before shipping these to customers.
The accelerated life test is a long burn-in, may take over 1000 hrs, to find the life of the normal chip. The theory is that when the chip is running at high voltage and high temp, the life is shortened exponentially. So if it can withstand 1000 hrs burnin, it may translate to some number of years of normal life under normal conditions.
All this is described in a bathtub curve.
Whether burn-in is necessary depends on:
1. quality requirement of your product
2. complexity of your design (chip size, digital vs analog vs RAMs)
3. maturity of the process
and last but not least
4. price/cost of your product
You can find more info in the publication under www.jedec.org.
Hi,
I would like to add to dr_dft's reply which is very good and accurate. You also use burn in testing to stress built PC boards to ensure that all solder joints are properly made. Marginal solder joints (and marginal tracks or vias) will become dry joints and fail quite quickly when they are subjected to continous burn-in for a couple of hours. If you combine this with some temperature cycling as well the process can be accelerated. (This is then becomes stress testing).
Regards.
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