Substrate design for flipchip package

[GowriAnand]

Hello.

I am trying to design a substrate for a flipchip Package.

I imported the die information thru the die text in wizard.(number of bumps is roughly around 2200).

Created the BGA thru the BGA generator (27X27 BGA , 0.8mm pitch, full array with 1:1:4 for pwr/gnd/signal distribution)

Created the B/B vias by using the B/B via generator.

Set up the constraints, cross-section details.

Auto assigned the signal nets, (Logic->AutoAssign).

After this, I'm trying to do a couple of things but getting stuck at every step :-?

Questions i have -

1. I'm basically following the tutorials but when i work on the step of adding the via structure, it basically does nothing. Steps I have followed : Clicked on Route->Generate Flipchip Generator. Selected the nets , right clicked and selected "add via structure". After this I don't see anything happening in the file.

2. How do we assign the power/ground bumps to the power/gnd solder balls. I assigned the rest of the signal nets through the auto assign command. I have around 15 small power planes.

Any help will be greatly appreciated.

Thanks in advance.



Best Regards.

 

[prasguy]

2. Logic - Assign net, click on Die-pin that which net u need to assign to ball pin,,, then again click on the bga ball, so the particular net what u want can be assigned.

1. Make sure the padstack you defined for VIA is correctly linked and available, also vary the parameters , so you can do proper fanout.