xyz348
Newbie level 2
Hi,
We are currently designing an SoC and have a question on sequence of VDD, GND pad placement in IO-Ring. Could anyone suggest on which option is best? and any reasons for it?
1. Sequence of : SIGNAL-IOVDD-SIGNAL-IOVSS-SIGNAL-COREVDD-SIGNAL-COREVSS
2. Sequence of : SIGNAL-IOVDD-IOVSS-SIGNAL-SIGNAL-COREVDD-COREVSS-SIGNAL
3. Sequence of : SIGNAL-SIGNAL-IOVDD-IOVSS-COREVDD-COREVSS-SIGNAL-SIGNAL
As per my understanding I wanted to go with #1, but would like to hear from experts on if there is any return-current-path that I need to care-about during pad-placement.
Please note that power-stripes are going to be in the fashion of "VDD-VSS" with minimal spacing for shortest return-current-path.
thanks in advance.
We are currently designing an SoC and have a question on sequence of VDD, GND pad placement in IO-Ring. Could anyone suggest on which option is best? and any reasons for it?
1. Sequence of : SIGNAL-IOVDD-SIGNAL-IOVSS-SIGNAL-COREVDD-SIGNAL-COREVSS
2. Sequence of : SIGNAL-IOVDD-IOVSS-SIGNAL-SIGNAL-COREVDD-COREVSS-SIGNAL
3. Sequence of : SIGNAL-SIGNAL-IOVDD-IOVSS-COREVDD-COREVSS-SIGNAL-SIGNAL
As per my understanding I wanted to go with #1, but would like to hear from experts on if there is any return-current-path that I need to care-about during pad-placement.
Please note that power-stripes are going to be in the fashion of "VDD-VSS" with minimal spacing for shortest return-current-path.
thanks in advance.