Hi All,
can anyone tell me how to generate a copper pour/ plane so that they connect through thermal ties only on smt pads and full connected(no thermals) with via and through holes
Thanks in advance
Regards
Hi,
Follow the below Steps,
First to place polygon go to Place/polygon pours, select the required amount of area to pour polygon.
Then go to design their select polygon connect style rule and different rules for pad and via.
For Pad --- pass query IsPad
For Via-----Pass query IsVia
For SMT pad to pass query as IsSmtPin