Could anyone explain in short how inductance build up between PCB traces can affect its performance(signal integrity)?Let say I have two 10 mil trace width with air gap between is 10mil and each carry 5mA at 1GHz.
Often 10mil spacing is NOT quite enough for keepout. Mutual EM coupling may get higher percentage with closer spacing. Usually we have to keep at least 2 times of trace width. You can refer to this document may helps!