stenzer
Advanced Member level 3
Hi,
during a FMEDA we came across the failure case "floating gate" and "floating base" for MOSFETs and BJTs, respectively. As this node is considered floating e.g. under the assumption the bonding wire within the package is electrically open (not conductive) there is quite a huge speculation range what can happen e.g. due to the inner structure of the transistor or building-up/down of charge. We already spent several hours discussing this issue.
- So my question is has anybody experience with that, or has any clue how to propperly deal and consider this issue?
- Is there a possebility of simulating this case with a Spice tool to gain somehow "plausible" results (I doubt that)? E.g. LTSpice is considering a gmin value ("Conductance added to every PN junction to aid convergence. "), so already the Spice tool interferes with the transistor model.
I'm thankfull for any advise.
BR
during a FMEDA we came across the failure case "floating gate" and "floating base" for MOSFETs and BJTs, respectively. As this node is considered floating e.g. under the assumption the bonding wire within the package is electrically open (not conductive) there is quite a huge speculation range what can happen e.g. due to the inner structure of the transistor or building-up/down of charge. We already spent several hours discussing this issue.
- So my question is has anybody experience with that, or has any clue how to propperly deal and consider this issue?
- Is there a possebility of simulating this case with a Spice tool to gain somehow "plausible" results (I doubt that)? E.g. LTSpice is considering a gmin value ("Conductance added to every PN junction to aid convergence. "), so already the Spice tool interferes with the transistor model.
I'm thankfull for any advise.
BR