Obviously, the comparison is focussing on injected noise current. But there are other aspects that may be more important in some cases, particularly ground bounce. Also fast analog circuits are often requiring minimal ground inductance and don't allow long fanout traces. Case six clearly fails these requirements.
Other points are that logic chips don't necessarily have equal count of GND and VCC pins, also often use multiple supply voltages. Connecting each ground pin directly to the ground plane, possibly with a microvia inside the pad may be more appropriate in these cases. The bypass capacitors are placed as near to the VCC pins as possible, the exact place of the supply via isn't so important.
If double sided placement is an option, the bypass capacitors may be placed directly under the VCC and GND pins, preferably using plugged vias in pads.