Comments on my PowerPCB design is welcome!!!

[ChineseDragon]

My design contains a BGA package which has 836 pins(6 rounds),please give me some advice on:
1) minimum layers requied;
2) design rules;
Any commnets are very welcomed!!!

 

[Elvis P.]

Hi CD!

Its hard to tell... very less information provided...

When i'm starting a projekt in the dimension that i think that you will do, i use 4 Layers: Signal/GND/VCC/Signal.
If it's more complex use more layers.

There are lots of posts in this forum on EMC and Board Layout you will find a bunch of information.

If you have more specific questions i can give you better answers...

regards
Elvis

 

[ted]

Generally speaking, with a large BGA you very often need more than 4 layers, and it depends....
Some factors having major impact in my experience:
*How many voltages you have to feed to the BGA? (maybe more than one voltage plane is needed....)
*How much space you have in between the "bumps"/pads?
*Minimum via size--you have a real pain if your rules do not allow combination of 4 BGA pads and a via in middle.....
*Design rules in general you plan/have to use? See the above two examples of practical issues, and figure out if you at all can get some wires and vias where you need them!
*how any wires you have to actually connect, usually there are many "n/c" pins in any given design.

A good practice might be to first check your rule set for the basic requirements and then try the layout.

Good luck,
Ted

 

[freeliver]

what's gap between pads? If this gap is small，I think 6 signal layer is a choice. you can fan out all pins .

 

[amjad]

U can go for minimum 6 sig layers.Set minimum 1 * track width spacing for track to pad, via,copper etc.,,,.Track to track spacing,,in BGA area go for 1 * track width spacing & go for 3 * track width spacing other than bga area.