wjf_wang
Newbie level 1
hi :
i am a package designer ,at present ,i take part in a project for multi-chip stackup ,i requiring some information about package design , for example ,during the causing the package design , wire bonding design is a very import step for the whole package substrate routing and layout. but i have not infomation and material in this field such as wire bonding design rules ,bond finger size ,bonding wrie angle etc. please give me some idea and help.
thanks!
i am a package designer ,at present ,i take part in a project for multi-chip stackup ,i requiring some information about package design , for example ,during the causing the package design , wire bonding design is a very import step for the whole package substrate routing and layout. but i have not infomation and material in this field such as wire bonding design rules ,bond finger size ,bonding wrie angle etc. please give me some idea and help.
thanks!