What is the meaning of DIE in IC manufacturing ?

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vikasveshan

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Hi all ,

What does DIE in reference to integrated circuits means ?
What are the differnt types of DIE and does an IC with with two diffferent DIE (Generations ) behave differently ??

Regards !!
V V
 

during ic manufacturing they fabricate wafers consisting of individual chips.

a wafer contains many individual chips , which is called as 'die'.

after fabricating , each individual die is tested and cut .
then they are packaged in a plastic or some carrier.
for eg, if you see a 20pin ic , inside you will have the die connected to external ic pins through wires.
 

Hi ,
Thanks for your reply !!

Does it mean that if an IC with similar packaging is manufactured using two different DIEs will have same electrical and physical characteristics.

Please Correct me if i am wrong .

Also what are the different types of DIEs ?

Regards !!
V V
 

cannot get what you exactly mean by 'two different die'.

a wafer will have 1000s of dies .
assuming that all are going to be of same ic ,
then each die is the unbonded form of the final ic.

if you get the two ics from the same batch , then their 'main' characteristics are same.

but a given ic is guaranteed for the parameters irrespective of the batch or wafer , by the manufacturer , thro quality control.
 

The following is a photo of Core 2 Duo die:



Core 2 Duo ``Allendale'' die size: , 65 W, 775 pin LGA

BigDog
 

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