Welcome to EDAboard.com

Welcome to our site! EDAboard.com is an international Electronics Discussion Forum focused on EDA software, circuits, schematics, books, theory, papers, asic, pld, 8051, DSP, Network, RF, Analog Design, PCB, Service Manuals... and a whole lot more! To participate you need to register. Registration is free. Click here to register now.

What is the meaning of DIE in IC manufacturing ?

Status
Not open for further replies.

vikasveshan

Member level 2
Joined
Dec 22, 2010
Messages
43
Helped
1
Reputation
2
Reaction score
1
Trophy points
1,288
Activity points
1,582
Hi all ,

What does DIE in reference to integrated circuits means ?
What are the differnt types of DIE and does an IC with with two diffferent DIE (Generations ) behave differently ??

Regards !!
V V
 

srizbf

Advanced Member level 5
Joined
Apr 3, 2010
Messages
1,995
Helped
417
Reputation
840
Reaction score
328
Trophy points
1,363
Activity points
10,985
during ic manufacturing they fabricate wafers consisting of individual chips.

a wafer contains many individual chips , which is called as 'die'.

after fabricating , each individual die is tested and cut .
then they are packaged in a plastic or some carrier.
for eg, if you see a 20pin ic , inside you will have the die connected to external ic pins through wires.
 

vikasveshan

Member level 2
Joined
Dec 22, 2010
Messages
43
Helped
1
Reputation
2
Reaction score
1
Trophy points
1,288
Activity points
1,582
Hi ,
Thanks for your reply !!

Does it mean that if an IC with similar packaging is manufactured using two different DIEs will have same electrical and physical characteristics.

Please Correct me if i am wrong .

Also what are the different types of DIEs ?

Regards !!
V V
 

srizbf

Advanced Member level 5
Joined
Apr 3, 2010
Messages
1,995
Helped
417
Reputation
840
Reaction score
328
Trophy points
1,363
Activity points
10,985
cannot get what you exactly mean by 'two different die'.

a wafer will have 1000s of dies .
assuming that all are going to be of same ic ,
then each die is the unbonded form of the final ic.

if you get the two ics from the same batch , then their 'main' characteristics are same.

but a given ic is guaranteed for the parameters irrespective of the batch or wafer , by the manufacturer , thro quality control.
 

bigdogguru

Administrator
Joined
Mar 12, 2010
Messages
9,831
Helped
2,349
Reputation
4,692
Reaction score
2,275
Trophy points
1,413
Location
Southwest, USA
Activity points
62,376
The following is a photo of Core 2 Duo die:

Core2DuoDie.png

Core 2 Duo ``Allendale'' die size: , 65 W, 775 pin LGA

BigDog
 

Status
Not open for further replies.

Part and Inventory Search

Welcome to EDABoard.com

Sponsor

Top