Jul 2, 2009 #1 H handsome Junior Member level 3 Joined Oct 17, 2003 Messages 31 Helped 1 Reputation 2 Reaction score 0 Trophy points 1,286 Activity points 191 die size staggered pad Hi,all In my project, die size is not big engouth to place all pads which use wire bongding. How can I slove this problem?I dont want to add the die size. Thx.
die size staggered pad Hi,all In my project, die size is not big engouth to place all pads which use wire bongding. How can I slove this problem?I dont want to add the die size. Thx.
Jul 4, 2009 #2 J jbeniston Advanced Member level 1 Joined May 5, 2005 Messages 460 Helped 106 Reputation 214 Reaction score 73 Trophy points 1,308 Activity points 3,494 die size and pad numer Use staggered pads instead of inline pads if you have them. Use flip chip instead of wire bond.
die size and pad numer Use staggered pads instead of inline pads if you have them. Use flip chip instead of wire bond.
Jul 6, 2009 #3 H handsome Junior Member level 3 Joined Oct 17, 2003 Messages 31 Helped 1 Reputation 2 Reaction score 0 Trophy points 1,286 Activity points 191 die size and pad numer jbeniston said: Use staggered pads instead of inline pads if you have them. Use flip chip instead of wire bond. Click to expand... Thx. I have used staggered pads. Flip chip will need more money. And I am not familiar with the FC‘s backend flow。 Can you tell me the difference between the nomal wire bonding PR flow and the FC's PR flow? Added after 1 minutes: Can anyone explain the "multi tier packages"?
die size and pad numer jbeniston said: Use staggered pads instead of inline pads if you have them. Use flip chip instead of wire bond. Click to expand... Thx. I have used staggered pads. Flip chip will need more money. And I am not familiar with the FC‘s backend flow。 Can you tell me the difference between the nomal wire bonding PR flow and the FC's PR flow? Added after 1 minutes: Can anyone explain the "multi tier packages"?
Jul 11, 2009 #4 H hiral.kotak Full Member level 2 Joined Aug 28, 2008 Messages 128 Helped 42 Reputation 84 Reaction score 31 Trophy points 1,308 Activity points 2,172 Re: die size and pad numer Hi, staggered pad approach is the good one. u can also use radially staggered pad placement. thanks.. HAK..
Re: die size and pad numer Hi, staggered pad approach is the good one. u can also use radially staggered pad placement. thanks.. HAK..