Jester
Full Member level 6
I have a small circuit, PCB is 1" x 1" that will placed in a small plastic enclosure 1"^3 and then filled with thermal epoxy.
Under normal conditions, power dissipated will be ~200mW.
Under fault condition (end user connects incorrectly), power dissipated could rise to 700mW
Can anyone help me determine temperature rise?
Under normal conditions, power dissipated will be ~200mW.
Under fault condition (end user connects incorrectly), power dissipated could rise to 700mW
Can anyone help me determine temperature rise?