sharkies
Member level 5
I have a 2.1 x 1.7 die requiring 48 pins.
Half of the pins are for digital, and the other half are for analog&RF
Since I have 48 pins, I am forced to use a big package. The down side is the large amount of inductance. I looked up AMKOR's MLF package and the inductance is 1nH for their 48pin package; This is assuming that die size is 4.5 X 4.5. Since my die size is much smaller than that (smaller than half of that), bond wires will be inevitably longer and have more inductance.
What should I do? my analog parts are a bit sensitive to these inductances. Is there a better package than MLF? BGA is not an option... Will COB(chip-on-board) help in my situation? I've been told that COB will not improve much since my pin numbers are already large and that alone will require my bondwire to be long....
Let me know . Thanks
Half of the pins are for digital, and the other half are for analog&RF
Since I have 48 pins, I am forced to use a big package. The down side is the large amount of inductance. I looked up AMKOR's MLF package and the inductance is 1nH for their 48pin package; This is assuming that die size is 4.5 X 4.5. Since my die size is much smaller than that (smaller than half of that), bond wires will be inevitably longer and have more inductance.
What should I do? my analog parts are a bit sensitive to these inductances. Is there a better package than MLF? BGA is not an option... Will COB(chip-on-board) help in my situation? I've been told that COB will not improve much since my pin numbers are already large and that alone will require my bondwire to be long....
Let me know . Thanks