circuit
Full Member level 2
I am designing a four layer board with inner 1 as ground and inner 2 as power with 4 different islands on it having different Vdds. Now i am routing couple of signals of 4th layer and it goes over a break in the power plane(with different Vdds). now do i just put stitching capacitors on either side of the slot from Vdd to ground ? These are low frequency signal, say in 100s of khz.
Also when i put a via on my signal running on 1st layer to take it to 4th layer and route in there, what about the return signal. do i put caps here to facilitate the return signal to move to 3rd layer ?
My pcb manufacturer recommends pad/hole size as pad to be 10 mils greater than drill size for vias and 14 mils greater than drill size for TH components. now is it enough if i maintain this coz i read that 1.8 pad/hole ratio is followed ?
Also when i put a via on my signal running on 1st layer to take it to 4th layer and route in there, what about the return signal. do i put caps here to facilitate the return signal to move to 3rd layer ?
My pcb manufacturer recommends pad/hole size as pad to be 10 mils greater than drill size for vias and 14 mils greater than drill size for TH components. now is it enough if i maintain this coz i read that 1.8 pad/hole ratio is followed ?