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1) Advanced Interconnect Modeling Technology in Microwave Office(R) and Analog Office
Accurate interconnect modeling is critical at board, package, and chip levels. Traditional interconnect models have shortcomings that can lead to serious errors in the prediction of system performance. In this seminar, the attendee will see a number of advanced interconnect models to overcome the limitations of traditional methods. Topics include: Inet™ technology, X models, and electromagnetic simulation technology as applied to interconnect models.
2) Signal Integrity Modeling of High Speed Analog Nets: Cross-Domain Simulation at the Chip, Package, and Board Levels
It is important that the behavior of the critical analog nets be accurately predicted as the chip, package, and board are being designed. The designer is faced with the task of a "cross-domain“ modeling problem, where the interconnect must be designed in different technologies concurrently. In this seminar, I show a specific example of an output signal from a power amplifer going from the chip, through bondwires onto the package, and then to the system board. The designer corrects for package mismatches by placing a capacitor on the board. Simulations incorporate the effects of the entire path. The example will be used to demonstrate layout and simulation in cross-domain technologies and the proper configuration of the setup files.
Cadence!!! which tools they have N number of tools?
And they don't provide complete solution in a single tool or environment..
They sell each feature of a peticular EDA tool as a different / add on tool or solution...in most of the cases it is aquired from other companies it is not developed in-house...
So their is lot of technology GAP to address nanometer solutions...