Sharing Pads between alternate components.

[jpradeeban]

Hi..

I am modifying my layout such that a TCXO (IT7520BE) can be replaced by an alternate TCXO (DSB221SDM). These 2 TCXOs has totally different foot prints, but the pins representations are same.
I will use one of these TCXO in the Production level.
So I would like to come out with a design such that the 2nd TCXO will share the output pad with the 1st TCXO. I have attached the datasheets and the design i suggest as the attachments.
During the Production a common stencil file will be manufactured (for SMD process). in the case of mounting the 1st TCXO there will be a little amount of solder paste underneith the TCXO because i share the space with alternate TCXO.
does this is design is compatible? will it cause any problems? Please give your suggestions.

 

[anilrock87]

Hi,

for me it seems to be okay........... If you have more space available in your design just add these things as separate parts.

 

[Mattylad]

Looks workable, just fix the track coming out of pad 4 as its at an angle that leaves an acid trap.

Can you have both in the solder paste screen or will this mean you need a screen per part?
Because it may not be a good idea to have unconnected pads with paste on underneath the primary component.