poornima2391
Newbie level 1
hello,
I am trying to model through-silicon-via [TSV] in ansoft HFSS.I have already built the model [3D] which is consisting of a rectangular silicon bulk with 2 through hole vias in it, where one via carries the signal and the another is taken as ground via.I want to extract the the S parameters of this model.Can anyone help me do this??
I am trying to model through-silicon-via [TSV] in ansoft HFSS.I have already built the model [3D] which is consisting of a rectangular silicon bulk with 2 through hole vias in it, where one via carries the signal and the another is taken as ground via.I want to extract the the S parameters of this model.Can anyone help me do this??