Welcome to EDAboard.com

Welcome to our site! EDAboard.com is an international Electronic Discussion Forum focused on EDA software, circuits, schematics, books, theory, papers, asic, pld, 8051, DSP, Network, RF, Analog Design, PCB, Service Manuals... and a whole lot more! To participate you need to register. Registration is free. Click here to register now.

Register Log in

RF (Bluetooth Module) Grounding in PCB Layout (4 Layered)

Status
Not open for further replies.

smith_suez

Member level 3
Joined
Jun 12, 2006
Messages
67
Helped
3
Reputation
6
Reaction score
0
Trophy points
1,286
Activity points
1,694
Hi ,
I am using bluetooth module(F2M03AC2 from FREE2MOVE)in my project.In the datasheet they have suggested to connect directly all the GND Pads to flooded GND plane.ALso if more than one GND is used make a connection between them using as many as vias.
In the layer stack up i have GND Plane below the TOP Layer were the module is mounted.
My question is ,will there be any issues when i connect directly the GND of Bluetooth module to the GND plane below to which rest of the circuit GND is connected.Will there be performance/EMI/SI issue in the rest of the circuit/ Bluettoth module...Please help
 

Rame

Full Member level 6
Joined
Dec 23, 2005
Messages
373
Helped
47
Reputation
94
Reaction score
7
Trophy points
1,298
Location
BANGALORE
Activity points
3,813
Re: RF (Bluetooth Module) Grounding in PCB Layout (4 Layered

Hi,

Blue tooth module is directly connected to the gnd plane,this is actually a good practise,your suppressing the noise to the ground plane and try to make a separate segration of module from the other function block.

For more information about the subject,check this sites you might get answer for your query..

http://www.radio-electronics.com/

http://www.sopcco.com/an4005__WirelessUSB_LS_Printed_Circuit_Board_Layout_Guidelines.pdf

http://www.jlab.org/accel/eecad/pdf/050rfdesign.pdf


Regards

Ramesh
 

    smith_suez

    points: 2
    Helpful Answer Positive Rating

rogerynt

Advanced Member level 4
Joined
Mar 6, 2007
Messages
119
Helped
19
Reputation
38
Reaction score
8
Trophy points
1,298
Activity points
1,927
Re: RF (Bluetooth Module) Grounding in PCB Layout (4 Layered

I would suggest to add capacitor component pad at each of the I/O pins with the following condition :

1.) Must place directly at Bluetooth module I/O pins;

2.) Capacitor gnd should directly loop back to Bluetooth module gnd. This is very, very important for Bluetooth module P.A. Vdd, P.A. on/off control.

The purpose of these caps. are for EMC issue especially 2nd harmonic. Very often emc failure is caused by leakage at I/O pins.

Rogerynt
 

Status
Not open for further replies.
Toggle Sidebar

Part and Inventory Search

Welcome to EDABoard.com

Sponsor

Top