I am using a 0.5mm pitch BGA package in a simple prototype PCB design. The package will have to be soldered by some machine using reflow techniques. I wanted to know what is the recommended PCB thickness so that PCB does not bend because of heat when package is mounted using heat reflow.
I am using a 0.5mm pitch BGA package in a simple prototype PCB design. The package will have to be soldered by some machine using reflow techniques. I wanted to know what is the recommended PCB thickness so that PCB does not bend because of heat when package is mounted using heat reflow.
Your PCB board is really small, SMT machine can't handle it, so you need panel a big one, the panel PCB board size should be bigger than 100mm*100mm is prefect.
According to the small board size, a thinner PCB stackup like 1 mm has the advantage of allowing smaller via drills. Check the available technology of your PCB manufacturer.