viperpaki007
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Hi,
I am using a 0.5mm pitch BGA package in a simple prototype PCB design. The package will have to be soldered by some machine using reflow techniques. I wanted to know what is the recommended PCB thickness so that PCB does not bend because of heat when package is mounted using heat reflow.
regards
I am using a 0.5mm pitch BGA package in a simple prototype PCB design. The package will have to be soldered by some machine using reflow techniques. I wanted to know what is the recommended PCB thickness so that PCB does not bend because of heat when package is mounted using heat reflow.
regards