Thank so much for your advice.
Now I have price problem.
I have received several quotations for HDI PCB fabrication.
- Board size: 40 mm x 40mm
- Quantity : 4
- Layer : 12
- Build-up PCB (HDI PCB): 3-6-3 (12 layers)
- Blind via: L1-L2, L2-L3, L3-L4, L9-L10-, L10-L11, L11-L12
- Buried via : L4-L9
- stacked microvia
In Korean PCB manufacturer, the prices was almost four times higher (about USD 2,700) than standard PCB (about USD 700).
For cost down, I requested new quotation for the following spec.
- Board size: 40 mm x 40mm
- Quantity : 4
- Layer : 10
- Build-up PCB (HDI PCB): 1-8-1 (10 layers)
- Blind via: L1-L2, L2-L3, L8-L9, L9-L10
- Buried via : L2-L9
- staggered microvia
In a Korea PCB manufacturer, the prices was almost three times higher (about USD 2,000) than standard PCB (about USD 700).
In a China PCB manufacturer, the prices was almost two times higher (about USD 1,400) than standard PCB (about USD 700).
With stacked via and more two lamination, the different price is about USD 700.
I think that the different price is small than I thought.
Just simpe HDI PCB stackup, the price is about three times.
Is it normal case ?
How do you think about the 1-8-1 (10 layers) stackup for the PCB design ?
Do you think that it is possible ?
I have a few PCB design experience and also it is first time for HDI PCB design.
Now I are going almost to give up HDI PCB design because of PCB fabrication cost.