Re: SOLDER MASK DOUBT
Having converging pads in solder mask for rather big parts as 0603 sounds strange to my opinion. It must no necessarily bring on solder shorts, but I would doubt if the used technology parameters and/or padstacks are appropriate.
Most PCB technolgy parameters use enlarged mask pads or not-solder-mask defined (NSMD) footprints. Usual mask to copper spacing is 50 to 100 µm (2 to 4 mil). 50 u is for ultra fine-line (structures of 100 um or below). The mask pad enlargement ist usually achieved in post process, so in the pad stack mask pads are identical to copper pads.
There is a minimal structure size that can be reproduced reliable in solder masks structuring. Particularly small bridges between rectangular pads are in danger of breaking away and worst case deposit on top of component pads, hindering reflow solder. If this minimal width can't be kept, e. g. with 0.5 or 0.4 mm TSSOP pin spacing, the mask pads may be enlarged in padstack to force converging. A minimal mask structure width of 100 um can be expected with today's fine line technologies to my opinion.
0603 has typically 800 um (30 mils) square pads and 700 um pad to pad spacing in reflow footprint. It has enough room for a standard wire passing through. Then the huge solder mask pads could be a serious issue.