ee484
Full Member level 3
While I was reading process manual, I faced the pad and bond pad terms.
It is related to layout issues and it explains that
1) the minimum pad width = 20um
2) the minimum bonding pad width = 100um
3) the minimum pad spacing = 15um
It has a figure that exaplains 2), but not 1) and 3).
The minimum bonding pad width, I think, defines the minimum pad or overglass layer width. This defines the area where bond wire is connected to.
What does 1) and 3), then?
Best,
B
It is related to layout issues and it explains that
1) the minimum pad width = 20um
2) the minimum bonding pad width = 100um
3) the minimum pad spacing = 15um
It has a figure that exaplains 2), but not 1) and 3).
The minimum bonding pad width, I think, defines the minimum pad or overglass layer width. This defines the area where bond wire is connected to.
What does 1) and 3), then?
Best,
B