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Question about pad and bond pad terms

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ee484

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While I was reading process manual, I faced the pad and bond pad terms.
It is related to layout issues and it explains that
1) the minimum pad width = 20um
2) the minimum bonding pad width = 100um
3) the minimum pad spacing = 15um

It has a figure that exaplains 2), but not 1) and 3).

The minimum bonding pad width, I think, defines the minimum pad or overglass layer width. This defines the area where bond wire is connected to.

What does 1) and 3), then?

Best,
B
 

Re: pad or bond pad?

Opening of windows in passivation can be demanded not only for bonding, but also for testing, trimming etc. Rules 1) and 3) just for these cases.
 

pad or bond pad?

pad always contains esd structures also so its size will be more than opening.

1 will define the opening of the pad after passivation .
2 will define the size of the pad.
3 will define the minimum spacing between two pads.
 

Re: pad or bond pad?

pit1000 said:
Opening of windows in passivation can be demanded not only for bonding, but also for testing, trimming etc. Rules 1) and 3) just for these cases.

In some design rules, there are 'probepad' or other 'user defined pad'.
 

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