Continue to Site

Welcome to EDAboard.com

Welcome to our site! EDAboard.com is an international Electronics Discussion Forum focused on EDA software, circuits, schematics, books, theory, papers, asic, pld, 8051, DSP, Network, RF, Analog Design, PCB, Service Manuals... and a whole lot more! To participate you need to register. Registration is free. Click here to register now.

dummy fill in PAD

Status
Not open for further replies.

goatmxj666

Member level 2
Joined
Mar 5, 2023
Messages
46
Helped
0
Reputation
0
Reaction score
1
Trophy points
8
Activity points
441
Hello,

I am doing layout with cadence virtuoso.

I drwaing poly and diffusion layers(utility) for density rule.

Is it possible to draw these layers on to the Pads? (pad contains only metal layers)

Thanks.
 

Some technologies prohibit "circuit under pad" and some promote it.
You'd have to get specific and look at your PDK's I/O construction rules.
Underlying topography should not bother the assembly process but
assembly "inputs" (like wedge bonding) can put strain on active devices
which either is, or looks like reliability degradation. A fabrication process
that allows "CUP" (circuit under pad) has to be qualified in concert with
a specific assembly recipe and vendor's control system.
 

Status
Not open for further replies.

Part and Inventory Search

Welcome to EDABoard.com

Sponsor

Back
Top