I want to scribe dies whoes size are 30mm*6mm from the wafer. Now I am worring whether the size of my dies is too large and there will be some cracks on the dies when dicing the chip.
The wafer size is 8 inch. Is there anyone who has some experience about this, please give me some advice. Thank you very much!
A saw operation ought to have no problem. The extreme aspect
ratio might pose some difficulty for a true scribe & break. Are
you committed to either approach?
A saw operation ought to have no problem. The extreme aspect
ratio might pose some difficulty for a true scribe & break. Are
you committed to either approach?