Problem about dicing, asking for suggestion!

[nksunmoon]

I want to scribe dies whoes size are 30mm*6mm from the wafer. Now I am worring whether the size of my dies is too large and there will be some cracks on the dies when dicing the chip.
The wafer size is 8 inch. Is there anyone who has some experience about this, please give me some advice. Thank you very much!

 

[erikl]

I'd recommend to first scribe the short side direction, then break out single columns, then go on scribing and breaking unit by unit.

 

[dick_freebird]

A saw operation ought to have no problem. The extreme aspect
ratio might pose some difficulty for a true scribe & break. Are
you committed to either approach?

 

[nksunmoon]

A saw operation ought to have no problem. The extreme aspect
ratio might pose some difficulty for a true scribe & break. Are
you committed to either approach?

I am worring about the ture scribe & break process.