Its only standard for 4 layer boards, a large number of boards these days are far more than 4 layers, then you add HDI PCB design to the equation and stack ups become infinitely variable.
PCB thermal management is also becoming more complex, my favourite tool for post design assessment is a thermal camera. Work out the basic requirements as best as possible using on line calculators, software if you have it and peer advice, but examining the finished product working at its full temp range using a thermal camera gives you invaluable feedback. Often parts that were not thought of as problematic can be the hottest. Of course you can also use Comsol multiphysics or similar, but for standard product the time and effort is not justifiable.