henry kissinger
Member level 2
I made transient simulations between on die termination (termination is after the wire bond) VS on board termination (termination is before the wire bond).
The result shows that the termination after the wire bond performs better with less ringing.
Does anyone know how to explain this phenomenon in simple words? I hope we are not getting into mathematical details. I prefer a conceptual explanation.
Thank you!!!
The result shows that the termination after the wire bond performs better with less ringing.
Does anyone know how to explain this phenomenon in simple words? I hope we are not getting into mathematical details. I prefer a conceptual explanation.
Thank you!!!