vandenm
Newbie level 3
sti layout cmos
Hi
Does anyone have any documentation or web links on sti stress? I'm particularly interested in where to position bulk connection/substrate taps. Everything I have read so far does not cover this area.
On larger processes I have layed out devices with say an M=6 in the following way:
b s g d g s b s g d g s b s g d g s b
I appreciate that critically matched devices should have dummy poly or individually placed transistors with or without dummy poly to relieve sti.
My question is, should bulk connections be avoided next to the source pins and should they be placed top or bottom or a ring if space permits?
Your help would be much appreciated.
Cheers
Hi
Does anyone have any documentation or web links on sti stress? I'm particularly interested in where to position bulk connection/substrate taps. Everything I have read so far does not cover this area.
On larger processes I have layed out devices with say an M=6 in the following way:
b s g d g s b s g d g s b s g d g s b
I appreciate that critically matched devices should have dummy poly or individually placed transistors with or without dummy poly to relieve sti.
My question is, should bulk connections be avoided next to the source pins and should they be placed top or bottom or a ring if space permits?
Your help would be much appreciated.
Cheers