There is nothing wrong with going into SMD pads at an angle, it is done regularly these days and is preferable to trying to go in to the square edge of the pad in many cases, it causes No issues.
The area under the chip is for the thermal pad, look at IPC-7093 and the recommendation by the device manufacturer, lots of data on how to do these devices, again they are common. Usually the solder paste screen is modified to limit the amount of solder and to avoid any thermal vias in the pad.