i want to design a LQFP80 thremal enhance pack, it has a 1x1(cm2) pad under the package for thremal enhance. how to design the package, and the what's the relation between the symbol's pin and package's pin?
and how to place a shape without mask solder?
thank you.
Well brother, we can answer You, but fundamental "detail" is needed like: What EDA Your use? Different EDA has different methods for implemantation of cooper planes... and layers names...
kimjin,
All you can define when you are creating padstack.
There is no hard & fast rule for creating antipad/thermalpad/mask. Standard companies have their own rules (it varies from company to company).
for generic information pls reffer to IPC standards
GoodLuck