rahulprem2013
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Silicon wafer will break along {111} planes if enough stress is applied. Top surface of the wafer is a (100) plane.
suppose the pressure is applied at a point on the surface of the wafer and {111} plane cleavage occurs through the pressure point, then how many pieces at maximum wafer is going to break ?
Thanks
suppose the pressure is applied at a point on the surface of the wafer and {111} plane cleavage occurs through the pressure point, then how many pieces at maximum wafer is going to break ?
Thanks