HFSS 3D Layout - How delete bump/ball w/o deleting the pin?

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farhill

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In HFSS 3D Layout, when you configure the device (die, BGA) as say, flip chip, the bump/ball will auto grow to each pin/pad. Now we need to delete the bumps attached to all non-port pin/pad to avoid shortcircuit. But in 3D Layout when selecting a bump/ball, the whole pin is selected. How to only delete bump/ball but reserve the pin/pad?
 

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