SughiRam P.
Member level 2
Hai,
I have used calculators for maximum current carrying capacity of a trace. The formula they used is I= K*(T^0.44)*(A^0.725). Here, K-Derating constant, T-Max temperature rise above ambient, A- Cross sectional Area (Copper thickness * Trace width).
My Doubt is, The Notation "T" is denoted as Max temperature rise above ambient. Whether it means maximum possible temperature the board will work? Is ambient temperature means Room Temperature?
Why we are using this derating constant?
My assumption is, T denotes the possible rise in Temperature around the Trace or board and Derating constant relates to plating. Can anyone Help me on this?
I have used calculators for maximum current carrying capacity of a trace. The formula they used is I= K*(T^0.44)*(A^0.725). Here, K-Derating constant, T-Max temperature rise above ambient, A- Cross sectional Area (Copper thickness * Trace width).
My Doubt is, The Notation "T" is denoted as Max temperature rise above ambient. Whether it means maximum possible temperature the board will work? Is ambient temperature means Room Temperature?
Why we are using this derating constant?
My assumption is, T denotes the possible rise in Temperature around the Trace or board and Derating constant relates to plating. Can anyone Help me on this?