handsome
Junior Member level 3
need for process
Dose flip chip need more process step than wire bond chip in foundry?
When are the UBM and BUMP added to the filp chip die? Before scribe wafer and after scribe wafer?
And if before scribe wafer , can filp chip die and wire bond die be produced in one wafer when MPW?
I am not familiar with the FC.
Thx
Added after 1 hours 51 minutes:
And can anyone explain the difference between wire bond chip and flip chip about ic backend layout, foundry process and package process ?
Dose flip chip need more process step than wire bond chip in foundry?
When are the UBM and BUMP added to the filp chip die? Before scribe wafer and after scribe wafer?
And if before scribe wafer , can filp chip die and wire bond die be produced in one wafer when MPW?
I am not familiar with the FC.
Thx
Added after 1 hours 51 minutes:
And can anyone explain the difference between wire bond chip and flip chip about ic backend layout, foundry process and package process ?
