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I hope i am getting your question right you want to put extra copper on layers so that there is even copper on layers.
For this you can provide copper fills but you have to do it manually at desired locations and layers.
Yes, I think the original poster is talking about copper thieving for interior signal layers. Makes the volume of copper more uniform both across the layer, and between paired layers. This leads to less potential warping/planarity problems. (May also be useful on top/bot layers for mask adhesion???)
I don't know how to get Altium to do this, but I believe that most board manufacturers can do it to your specifications after you give them the gerber files. Much in the same way that they can use their CAM tools to add other features like teardrops, etc. after the fact.
Another question is why dots are preferred? Dots are floating copper. Could potentially mess with any impedance matching. Using solid or hatched GND pours that are well stitched into a GND plane can be calculated for impedance effects, and can help reduce noise in a design. Also good for thermal dissipation.
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