T
treez
Guest
Hello,
Please can you evaluate this method of ensuring that the reading of infra red temperature monitors is correct? (it relates to accurately reading the temperature of components in an smps).
Infrared thermometer:
**broken link removed**
When testing an SMPS, it is essential to do thermal tests on the various components, eg the diode, the FET, the transformer (or inductor) ferrite, the current sense resistors, etc etc.
The fastest way to test for temperature of any of these components is to use an infra-red temperature monitor, because it simply involves pointing the infra-red monitor at the component surface and reading off the temperature.
However the problem with all of these devices is that the temperature reading is affected by the type and color of the component’s surface material. (eg shiny metal heatsink surfaces may often read lower temprature than they actually are)
We cannot know whether the particular infra red monitor is calibrated to accurately read the temperature of the particular material that its being pointed at.
Therefore, we must make up a “calibration SMPS”. This comprises an SMPS with thermocouples glued to each of its components.
It should be ensured that this “calibration smps” comprises both shiny as well as anodised heat sinks etc etc. One simply then points the infra red monitor at the various components of this “calibration SMPS” and checks to see if the reading of the infra red monitor corresponds to the readings on the thermocouple reader for each type of component.
Then one can confidently use this infra red monitor on the SMPS under test.
Why do no companies do this?
Please can you evaluate this method of ensuring that the reading of infra red temperature monitors is correct? (it relates to accurately reading the temperature of components in an smps).
Infrared thermometer:
**broken link removed**
When testing an SMPS, it is essential to do thermal tests on the various components, eg the diode, the FET, the transformer (or inductor) ferrite, the current sense resistors, etc etc.
The fastest way to test for temperature of any of these components is to use an infra-red temperature monitor, because it simply involves pointing the infra-red monitor at the component surface and reading off the temperature.
However the problem with all of these devices is that the temperature reading is affected by the type and color of the component’s surface material. (eg shiny metal heatsink surfaces may often read lower temprature than they actually are)
We cannot know whether the particular infra red monitor is calibrated to accurately read the temperature of the particular material that its being pointed at.
Therefore, we must make up a “calibration SMPS”. This comprises an SMPS with thermocouples glued to each of its components.
It should be ensured that this “calibration smps” comprises both shiny as well as anodised heat sinks etc etc. One simply then points the infra red monitor at the various components of this “calibration SMPS” and checks to see if the reading of the infra red monitor corresponds to the readings on the thermocouple reader for each type of component.
Then one can confidently use this infra red monitor on the SMPS under test.
Why do no companies do this?