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Soldermask is a negative image layer that covers everything unless a void is placed to expose the underlying copper layer. All modern EDA packages automatically expose surface pads, via annulus rings, and pad annulus rings by placing an appropriate shape on the mask layer for you. The amount of pullback from the copper is defined in your design rule setup.
You can expose other features on the underlying copper by defining a shape on the mask layer manually - exactly how you would do that depends on your EDA package.
This can be done in PADS software in SETUP-->PADSTACKS by oversizing the pad size by required amount in the mask layer OR you have another option which works for any software i.e you can do oversize in CAM in the mask layer
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