AllenD
Member level 5
Hi Team,
I am using TSMC 65nm CMOS technology to layout a mixed signal circuit. I am finishing up my layout with a few questions
1. I am planning to use the CUP(circuit under pad) pad with 60um pitch distance as my I/O pad. And I want to connect the pad to an ADC through wire-bonding and PCB. This is my first tape-out and I am worried my output stage's capability to drive the load. TSMC only offers a GDS file for pads without any schematic. Can anyone teach me how should I model the loading?
2. My circuit has 2 sets of supply. Ther are (0V GND ~ 1.2V VDD) and (-0.5V VSS ~ 2V VDD2.5). When I use calibre to run LVS, the calibre can only recognize one set of bias (0V GND ~ 1.2V VDD). Can anyone teach me how to run LVS with 2 power rails?
3. I am confused about metal density DRC. For now, I turned off the density check because I am under the impression that density can be fixed by the auto filler tool. And also some of the density rules are almost impossible to meet for higher metals, where I made the global connections. So Should I just leave the density apart and wait for the filler tool to fill in the circuit?
Thanks
Allen
I am using TSMC 65nm CMOS technology to layout a mixed signal circuit. I am finishing up my layout with a few questions
1. I am planning to use the CUP(circuit under pad) pad with 60um pitch distance as my I/O pad. And I want to connect the pad to an ADC through wire-bonding and PCB. This is my first tape-out and I am worried my output stage's capability to drive the load. TSMC only offers a GDS file for pads without any schematic. Can anyone teach me how should I model the loading?
2. My circuit has 2 sets of supply. Ther are (0V GND ~ 1.2V VDD) and (-0.5V VSS ~ 2V VDD2.5). When I use calibre to run LVS, the calibre can only recognize one set of bias (0V GND ~ 1.2V VDD). Can anyone teach me how to run LVS with 2 power rails?
3. I am confused about metal density DRC. For now, I turned off the density check because I am under the impression that density can be fixed by the auto filler tool. And also some of the density rules are almost impossible to meet for higher metals, where I made the global connections. So Should I just leave the density apart and wait for the filler tool to fill in the circuit?
Thanks
Allen