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Recent content by sunjimmy

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    Can INTEL i3/i5 CPU be used to install RHEL 4.0?

    Thank you for your reply first. I am going to build a new Linux box for EDA simulation recently. I plan to use intel i3/i5 4-core CPU to install RHEL 4.0, but i am worrying that whether I will encounter compatible problems or difficult-to-solve HW driver issue or not? Can anyone who had the...
  2. S

    10-bit SAR ADC, Unit-Cap size, Poly-Poly Caps

    For 10-bit resolution, 20umx20um to 25umx25um should be fine.
  3. S

    the best way to control leakage?

    How about adding distributed large-size PMOS power switch with high Vt ?
  4. S

    if any free verilog-A simulator for windows XP is available

    What version of modelsim will support Verilog-A ??
  5. S

    CUP - circuit under pad

    Compared to convential PAD structure, the ESD ckt is put under PAD. So the dimension of I/O pad is reduced. (because in the conventional PAD structure, the ESD ckt can't be put under PAD, so need more area for ESD ckt)
  6. S

    Why PMOS and NMOS are sized equally in a Transmission Gates

    transmission gates-asic Sometimes we use the same size of PMOS and NMOS for easy layout. Besides, the junction capacitance is another consideration,too.
  7. S

    Give some techniques to minimize power consumption

    The most easy way is to use advanced process. Because core voltage can be reduced, and power is propotional to V square. Besides, in most SoC design the embedded SRAM is almost the power-hunger monster. The advanced process is more flavor due to its area and power in terms of embedded SRAM,too.
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    80MS/S 10bit 8channel A/D

    Dear My friend, I don't think that you can find the part with 8-channel 10-bit 80MSPS ADC. If possible, you should use 8pcs ADC to fulfill your requirement. May you kindly let us know what kind of application you plan to build ?? Thanks,
  9. S

    relation between metal density rule and yield

    Besides the etching process effect, some optical effect during fabrication has more impact, specially for deep sub-micron technology. More uniform metal density helps the lithography.
  10. S

    clock data recovery (all digital)

    There are some IEEE papers which talk about this topics. You may google it then ask for thoses papers on the forum. Hope it helps
  11. S

    From gate-level to transistor level

    Design compiler can translate your gate-level logic design into real cell-based design with cells from library. These cells are composed with real transistor-level circuit with specific sizes and connection.
  12. S

    Decoupling capacitor and NMOS

    Both NMOS and PMOS can be used as decoupling cap between VDD and GND inside chip.
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    How does I/O design differ from std cell design?

    I/O Design The main focus on general-purpose of I/O design is reliability. Like ESD and Latch-up. The circuit design and layout concepts are almost around these 2 topics. Unfortunately, the reliability issues can't be simulated by Spice. Although the design and layout guidelines are provided by...
  14. S

    Design of ESD circuits.

    Usually the I/O PAD provided by foundary is too big. Some company will design their own I/O PAD for area consideration. There are many books and IEEE papers talking about this topic. You may find them via google. The whole chip ESD design/consideration is more than just I/O PAD itself. Most...
  15. S

    software reset & hardware reset???????

    Usually software reset can't really reset the whole HW FSM which is responsible for the software execution. But HW reset can reset the whole HW FSM (including SW FSM if any).

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