Thank for your suggestions.
we did contact the corresponding party who supply the IC service to us. They don't provide bond ring and pad layout. Anyway, we have found a way to make the pad.
I find another problem regarding to the UMC 0.25u process, that is, I cannot draw the metal slot. Usually in the cadence virtuoso in other processes, we can choose metal hole to draw slots in the case of large area of metals used. But in UMC 0.25u, we cannot find the pattern of metal hole. is there anybody met such a problem before? how to draw the metal slots in this situations? thanks