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Package designing is coonecting the wafer ballpads to the bga leads. It also had its own rules.
You can use allegro APD or padspowerbga.wirebonds takes the leads from the ballpads to outer ring of power and ground.Signals ou can route. Earlie veryting is done on sngale layer ,but now morethan single layers are in use,but i dont what fab technology adopted.
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