Welcome to our site! EDAboard.com is an international Electronics Discussion Forum focused on EDA software, circuits, schematics, books, theory, papers, asic, pld, 8051, DSP, Network, RF, Analog Design, PCB, Service Manuals... and a whole lot more! To participate you need to register. Registration is free. Click here to register now.
Package designing is coonecting the wafer ballpads to the bga leads. It also had its own rules.
You can use allegro APD or padspowerbga.wirebonds takes the leads from the ballpads to outer ring of power and ground.Signals ou can route. Earlie veryting is done on sngale layer ,but now morethan single layers are in use,but i dont what fab technology adopted.
This site uses cookies to help personalise content, tailor your experience and to keep you logged in if you register.
By continuing to use this site, you are consenting to our use of cookies.
