Recently Intel has announced that CMOS manufacturing capability can extend till 17nm beyond which it will be very difficult to manufacture the devices. The yield goes down with shrink in technology because of various issues that come into picture (UDSM issues) The next future embeds devices like mems in the design. The lithographic process becomes very difficult as device size shrinks. presently they are using exteme ultra-violet rays for photolithography and developing new light sources for shrinking technology. The CMOS process would exist for another ten years ,till then you need not have to worry.