After tape-out may have some error, now i want to know what is the most frequence error after tape-out.
1. function error
2. timing error
3. signal intergrate
4. don't know
thanks!
1. glitch(cannot found in FPGA)
2. timing(simulation/AE testing not complete , logic/model error ... )
3. leak current , floating signal , power consumption not as expected.
power consumption is the most critical things for IC design and it is the most commonly see error after tape-out.
i have another experience that my designers reluctanted to use foundry provided black box ESD protection circuit (because it is too huge) and they designed the ESD protection circuit by their own, unfortunately after tape-out, i found out that the ESD protection was not up to the expectation. therefore we had to re-tape out.
I think the most error is IO interface timing error.
stormwolf said:
After tape-out may have some error, now i want to know what is the most frequence error after tape-out.
1. function error
2. timing error
3. signal intergrate
4. don't know
thanks!