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Ground bounce is due to rapid current sink/source thru bonding wire between ground pad and package pin. dV= L(dI/dt)
SO the methods to mitigate this ground bouncing effect are:
(1) lower the inductance(L):
for example; double/triple bonding for groung pin. or using flip-chip packaging, ...,etc.
(2) lower the current spike(dI/dt):
for example; using slew-rate control output buffer, decoupling cap in internal power-gnd net, well controlled slew-rate of internal signal with adequate buffer size, ..., etc.