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electro migration : is phenomena happen in the metal interconnects in IC , if the current deneisty is high , the metal atoms will begin to move from its location due to high collisions with the electric current electrons , as the atoms move , the metal begins to break in this region and become open circuit
Electromigration occurs when a piece of metal track has too much current .
The impact of moving carriers with stationary ones causes the metal to degrade over time until either a short/open occurs.
As the previous post mention it would be wise to buy the Art of analog layout or something similar.
here you will find a nice explanation of electromigration **broken link removed**
basically , how the previous guys explained again, if the metal have a poor current density , in time the atoms of the metal from the border of the metal will flow
the best method to prevent that is to cut small slices (making some slots)in the large metals. usual the DRC rules will have special rules for the electromigration , some of the large metals rules will help you to avoid the electromigration issues .
This is why usually matching network is not fabricated inside the power amplifier. due to electromigration casued by large current in the PA you have to use large spacing on the chip for the matching network so the area will be large.
its just sipmly gradual wareout of the metal due to constat flow of high DC currents if there is not enough width of metal to carry that current. Electromigration will create the hilllocks(shorts) and voids(opens)
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